Business Tech

Texas Instruments’ DLP technology offers high-precision digital lithography for complex packaging

TI’s DLP technology enables maskless digital lithography systems for advanced packaging.

Texas Instruments (TI) is advancing digital lithography with the DLP991UUV digital micromirror device (DMD), its highest resolution direct imaging solution yet. With 8.9 million pixels and a data rate of 110 gigapixels per second, it eliminates costly mask technology while providing the scalability and precision needed for advanced packaging.

According to TI, maskless digital lithography machines, which project light to etch circuit designs without a photomask, are gaining popularity in advanced packaging. This method integrates multiple chips into a single package, allowing high-computing applications like data centers and 5G to be smaller, faster, and more power-efficient.

With TI DLP technology, manufacturers can utilize maskless digital lithography for high-resolution printing in advanced packaging, and the DLP991UUV provides precise pixel control and high-speed performance.

“Just as we redefined cinema by enabling the transition from film to digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI. “We’re enabling the creation of maskless digital lithography systems that empower engineers around the world to breakthrough the current limits of advanced packaging and bring powerful computing solutions to market.”

Improving advanced packaging requires cost-effective, scalable, and precise lithography technology. TI’s DLP technology reduces manufacturing costs by eliminating mask infrastructure and allows for real-time design adjustments. It achieves sub-micron precision on any substrate size, leading to higher throughput, improved yield, and fewer defects. These advantages are crucial for advanced packaging manufacturers to meet growing demands for high-bandwidth, low-power components in AI systems and 5G networks.

The DLP991UUV is the latest and leading device of TI’s direct imaging portfolio. Key features of the device include:

  • Highest resolution in the portfolio, offering more than 8.9 Megapixels
  • Fastest processing speed of up to 110 Gigapixels per second
  • Power levels of 22.5W/cm² at 405nm
  • Ability to operate at wavelengths as low as 343nm
  • Smallest mirror pitch in the portfolio of 5.4um

Texas Instruments DLP technology uses millions of tiny mirrors to provide high-resolution displays and efficient light control. This technology supports various applications, from projecting stunning 4K content in home theaters to improving road safety with smart automotive lighting and enhancing precision in industrial manufacturing with lithography and machine vision systems.

Availability

Preproduction quantities of the new DLP991UUV DMD are available for purchase now on TI.com. Multiple payment and shipping options are available.

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