HSINCHU, Jan. 10, 2023 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of December 2022 and for the fourth quarter ended December 31, 2022. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.73 to US$1.00 as of December 30, 2022.
Revenue for the fourth quarter of 2022 was NT$4,686.2 million or US$152.5 million, representing a decrease of 10.8% from the third quarter of 2022, and a decrease of 31.0% from the fourth quarter of 2021.
Revenue for the month of December 2022 was NT$1,553.8 million or US$50.6 million, representing a decrease of 0.3% from November 2022, and a decrease of 31.4% from December 2021.
The Company noted that the December period results reflect broader market declines and inventory adjustments at customers in response to end market demand levels. The Company previously took actions to mitigate the impact through reduced CapEx spending, utilization sustainability initiatives, increased factory automation and operating expense reductions, as it continues to provide the high level of customer support customers rely on ChipMOS for.
Consolidated Monthly Revenues (Unaudited)
Consolidated Quarterly Revenues (Unaudited)
ChipMOS TECHNOLOGIES INC.
+886-6-5052388 ext. 7715
In the U.S.
Global IR Partners
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the “SEC”) and in the Company’s other filings with the SEC.