On Day 2 of CES 2021, AMD President and CEO Dr. Lisa Su delivered a keynote on the the importance of high-performance computing in people’s daily lives and the ways in which the acceleration of digital transformation – at home and at work – point to a bright future this year and beyond.
Joining the keynote on stage with Dr. Lisa Su was various AMD partners: HP CEO Enrique Lores, Lenovo CEO Yang Yuanqing, Vice President of Technology for Lucasfilm François Chardavoine, Mercedes-AMG Petronas Formula One Team Driver Lewis Hamilton and Team Principal and CEO Toto Wolff, and Microsoft Chief Product Officer Panos Panay. Each of the partners how they benefited from partnering with AMD to create amazing products, services and experiences to people around the world. From the key note, Lewis Hamilton from Mercedes-AMG Petronas Formula One Team and 2020 Formula 1 World Champion, discussed the role of high-performance computing in racing, from the design and testing of the car to the analysis of race data for competitive advantage.
The keynote also saw the unveiling of AMD Ryzen 5000 Series Mobile Processors. The chips is based on the based on the “Zen 3” core which offers performance with the power efficiency needed for next-generation mobile PC computing. The Ryzen 5000 Series Mobile Processors includes AMD Ryzen 5000 U-Series Processors optimized for thin and light notebooks, as well as AMD Ryzen 5000 H-Series Processors for mobile gamers and creators. Expect every notebook OEMs, including Asus, HP and Lenovo, to bring AMD Ryzen 5000 systems to market starting in February, with more than 150 systems expected to launch this year.
During the keynote, Dr. Su also provided the first public demonstration of the 3rd Gen AMD EPYC processor, codenamed “Milan.” The demonstration featured the Weather Research and Forecast (WRF) Model – used in more than 160 countries – crunching through a compute-intensive weather forecast for the continental United States, with two 32-core “Milan” processors outperforming two of the competition’s highest end dual socket processors by ~68%. AMD plans to announce product and ecosystem details in Q1 2021.